Abstract: This paper reports the microstructural evolution and failure behavior of Sn-rich solder joints subjected to alternating current (AC) electromigration (EM) loads. SAC (Sn-Ag-Cu) alloy solder ...
Abstract: Since 2006 and the introduction of the RoHS legislation preventing the use of lead in electronic assemblies, lead-free solder alloys have gained interest amongst the industry and academics ...
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