The company’s innovations, showcased at the OCP Global Summit, are designed to drive the latest AI-based data centers.

The latest incarnation is the Vera Rubin Compute Tray (Fig. 2) that hosts the Rubin CPX GPU. The upgraded specification is ...

The 2025 OCP Global Summit, held in San Jose, Calif., on October 13-16, was sponsored by the Open Compute Project (OCP). OCP ...

The new switches are designed to deliver increased bandwidth, low latency, and advanced security for HPC, AI, and data center applications.

A 2-GHz, dual-core Arm Cortex-A55 can run Linux, including support for Yocto Linux and Android. And the system manager CPU is ...

Uncover how mixed-signal ICs are transforming medical wearables with smaller and more power-efficient sensor integration, ...

Supercapacitors possess a high cycle efficiency (more than a million cycles), a large number of charging cycles higher than ...

Qualcomm buys Arduino—and a Dragonwing MPU and STMicro MCU now creates the latest board, Arduino UNO Q, with development ...

The next wave of high-efficiency DC-DC converters will reshape power delivery in applications ranging from DC microgrids to ...

Using metamaterials, light-driven additive manufacturing, and other techniques, researchers have created innovative pressure ...

Tessent AnalogTest software enables up to 100X faster testing of analog circuitry in ICs, according to the company.

Uncertainty is one of the semiconductor industry’s most daunting challenges. This article offers tips on how to develop ...