AURORA, CO ― March 2026 ― AdvancedPCB has expanded its high-density interconnect (HDI) quality inspection capabilities with the installation of the CIMS Phoenix MDI AOI system in its Chandler, Arizona ...
PENANG, MALAYSIA – Penang-based semiconductor component manufacturer SQ Advanced Interconnect plans to list on the main market of Bursa Malaysia as it seeks to fund manufacturing expansion, research ...
TAOYUAN, TAIWAN – The Taiwan Printed Circuit Association (TPCA) has released its first Taiwan PCB Industry Risk Governance Strategy, outlining six action pathways designed to strengthen long-term ...
Global tablet shipments declined by around 3% QoQ and 4% YoY in Q4 2025, marking a clear step into a more mature phase for the market, according to Counterpoint Research’s latest Global Tablet Market ...
Schmid’s advanced wet processing InfinityLine H+ and InfinityLine V+ platforms are working horses, specifically engineered to meet these requirements, enabling manufacturers to reliably produce ...
PEACHTREE CITY, GA – March 13, 2026 – The early bird discount for the PCB East 2026 technical conference ends March 27, conference organizers said today. From March 28 through April 28, registrants ...
CI-ONE integrates a Ka-band power amplifier and single-pole double-throw (SPDT) RF switch into a compact surface-mount module designed for satellite communication, aerospace, radar and emerging 5G/6G ...
ATLANTA, GA – Electronic Component Trends and Sentiment report for November shows the industry’s outlook strengthening far ahead of expectations, with the overall sentiment index reaching 120.1 – well ...
Coating traces or filling vias is usually a wasted expense. We are often dismayed by the number of individuals (and especially board manufacturers) who suggest that coating a trace or filling a via ...
TOKYO, JAPAN – Meiko Electronics has raised its fiscal 2025 consolidated earnings forecast, citing sustained demand for high-density interconnect (HDI) printed circuit boards and favorable currency ...
SEOUL – Doosan Corp. has launched mass production at its new flexible copper-clad laminate (FCCL) plant in Gimje, North Jeolla Province, targeting the fast-growing foldable smartphone and wearable ...
550/560 Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 ...