The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen.

One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

You can achieve a lot with a Dremel. For instance, apparently you can slim the original NES down into the hand-held form-factor. Both the CPU and the PPU (Picture Processing Unit) are 40-pin DIP chips ...

QFN bad soldering is often happening in SMT assemble, consider from many aspects, such as pad design, PCB storage, chip control and management, solder paste management and use, furnace temperature ...

MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a ...

With over 200 million motors produced every year with fractional horse power, the opportunity to save energy by adopting an electronically controlled variable speed solution is very significant. In ...

BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...