BILLERICA, Mass.--(BUSINESS WIRE)--NEXX Systems today announced a multi-year joint development program with IBM on advanced semiconductor chip packaging and integration. In the program, IBM and NEXX ...
SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging ...
FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Applied Materials Inc. introduced its 300mm SlimCell electrochemical plating (ECP) system today, likening its technology over that of standard ECP to that of single wafer processing vs. batch ...
SAN FRANCISCO — During the Semicon West trade show here, fab tool vendor Novellus Systems Inc. has rolled out a new electroplating system for the wafer-level packaging (WLP) market. Based on Novellus’ ...
FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc.
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